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Application Introduction


NDT's mobile phone power/volume keys solution replaces traditional mechanical keys and continues the user habits. Support multiple adjustment methods such as sliding, clicking, and pressing to realize multiple functional interactions.Such as adjusting the volume, waking up the mobile assistant switching the phone on and off, etc.


With the vibration feedback of the motor, the pressing vibration is crisp and neat, the experience is delicate and realistic, and the interaction is more natural.



Sliding, clicking and pressing adjustment method

Multi-functional interaction, expanding usage scenarios

Appearance without bumps, integrated design

Continuation of user operating habits, zero learning costs

Waterproof, easy to assemble

Features & Advantages

NDT Micro Strain Gauge Force Capacitance / Inductance MEMS
Theory Detected panel strain/curvature changes are resulting in resistance changes, Capacitance changes or inductance resonant frequency changes are caused by spacing variation The change in the spacing between the measuring panel and the fixed position results in the extrusion of the contact point of the MEMS
Installation structure


Single-layer FPC structure, attached directly to the back of the panel

Double-layer structure, using support structure to control the gap

Need to ensure a spacing between the panel and the fixed position

Appearance Dimension Flexible FPC,dimension can be customized; Maximum thickness 0.18mm(including tape DST&FPC) 0.6mm Thickness 0.6mm Thickness
Assembly process Back of FPC double-sided adhesive(VHB) directly attached to the back of the panel Double-sided attached Plug-in assembly

Direct detection of panel deformation without gap control, product consistency/ high reliability


Single-sided attached process and simple assembly

Need to strictly control the gap, easily affected by assembly tolerances and drop/deformation, poor consistency/reliability


Double-sided attached process and complex assembly

Need strong tightness support, easy to be affected by assembly tolerances and drop/deformation, poor consistency/reliability


Plug-in assembly process and complex assembly



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